Cooling Teraflop Chips

Intel announced last year the first tera-flop chip containing 80 cores on a single die. This chip has equivalent performance to a 10,000 processor (single core) machine about 12 years ago. How does one cool such chips -- which are likely to generate large amounts of heat. IBM has a water-based cooling system around "3D" chips, with thousands of hair-width cooling arteries. The Stanford University spin-off company Cooligy has been developing "micro-structure cooling loops" using fluids to remove heat and noise. As there is a greater commercial push to create low heat emission data centres, support for such cooling technologies will become even more important.